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Home > Electronic Components > Seoul Semiconductor Z-Power LED P9 Series Teardown and Technology Analysis
Business Report
Seoul Semiconductor Z-Power LED P9 Series Teardown and Technology Analysis
- Published by: MuAnalysis
- Published: March, 2009
- Format : PDF /
- Delivery: E-Mail within 1-2 business days
- Product ID: 83874
Description
Abstract
Reported to contain a SemiLEDs die on flexible copper substrate and the subject of much controversy and feuding between Nichia and Seoul Semiconductor, this device has indeed a very interesting die.
MuAnalysis has used a large variety of analytical techniques including electron microscopy with photochemical delineation and EDX to probe the technology of this LED lamp and reveal its secrets. Protection circuitry, process sequence and epi-stack are described in detail supported by plenty of photos, tables and graphs.
Table of Contents
Table of Contents
1. Product Identification
2. External Appearance and Principal Dimensions
3. Package General Description
- Fluorescent medium and encapsulation
- Die configuration and attach
- Electrical protection
- Table of package parameters
4. Semiconductor Die
- Materials, dimensions, and singulation
- Appearance
- Lower level contact
- Upper level contact
- Epi-stack
- Process sequence
- Table of die process parameters
5. Summary
