Lumileds Luxeon K2 LED LampTeardown and Technology Analysis

The device is a surface mount gull wing device containing a GaN LED chip. Considerable attention has been paid to current distribution, heat dissipation, and to reflectivity in this device.

MuAnalysis has used a large variety of analytical techniques including electron microscopy with photochemical delineation, EDX and FTIR spectroscopy to probe the insides of this LED lamp and reveal its secrets. Back-side appearance, front-side interconnect, redistribution layer, lower & upper level contact, table of die process parameters, Epi-stack are described in detail with plenty of photos, tables and graphs.

h4. Product Identification

2. External Appearance and Principal Dimensions

3. Package General Description

• Substrate structure and material
• Lens assembly
• Phosphor and encapsulation
• Die configuration and attach
• Electrical protection
• Table of package parameters

4. Semiconductor Die

• Materials, dimensions, and singulation
• Back-side appearance
• Front-side interconnect
  • Redistribution layer
  • Lower level contact
  • Upper level contact
• Epi-stack
• Table of die process parameters

5. Summary