Impact of Wafer-level Camera Modules on the CCM Industry Supply Chain

Abstract

CCMs are developing towards smaller sizes and lower costs. However, traditional CCM assembly methods are restricted by materials and technology, and there are bottlenecks in terms of product cost control. As a result, wafer-level camera modules have emerged. Wafer-level camera modules make use of semiconductor production processes to manufacture optical components, and are integrated with the image sensor. This process can enable companies to achieve their goals of making modules smaller and lowering prices. Large-scale production and low prices will threaten existing camera module makers, and could also lead to changes in the CCM industry supply chain. However, a challenge for wafer-level modules is yield rate, which will have to increase significantly before they will have a significant impact.

Table of Contents

Table of Content

• 1. Small Size and Low Cost Are Advantages of Wafer-level Camera Modules
• 2. Changes in the CCM Industry Supply Chain
• MIC Perspective
• Appendix

List of Topics

• Analysis of advantages and disadvantages of different CCM assembly methods
• Emergence of wafer-level camera modules and their technological characteristics
• Impact of wafer-level camera modules on the existing CCM industry supply chain, including impact on different component suppliers
• Companies and organizations analyzed or mentioned in the report include: Aptina, Digital Optics, Eyesquad, FotoNation, Foxonn, Fujinon, Heptagon, Kantatsu, Kolen, Konica Minolta, Largan, MagnaChip, Mitsumi, OV, Panasonic, Samsung, Samsung Tech, SEMCO, Sharp, Shellcase, Siliconfile, Sony, ST Micro, Tessera, Toshiba, VisEra Technologies, VistaPoint, Xintec

List of Tables

• Table 1 Key Players in the Worldwide CCM Supply Chain

List of Figures

• Figure 1 The Evolving CCM Supply Chain