Worldwide Mobile Phone Semiconductor 2009 Vendor Shares

Abstract

This IDC update and the accompanying Excel file provide a vendor share ranking for the worldwide mobile phone semiconductor market for calendar year 2009. Comparisons are made to the prior year' s results, CY08, and the analysis is broken down by air interface technology and device type. For prior vendor share analyses, see Worldwide Mobile Phone Semiconductor 2008 Vendor Shares (IDC #219085, July 2009). The accompanying Excel file includes:

• Worldwide total mobile phone semiconductor rankings by revenue for CY09
• Worldwide 3.5G (HSPA) mobile phone semiconductor rankings by revenue
• Worldwide 3G (EV-DO, WCDMA/UMTS, TD-SCDMA) mobile phone semiconductor rankings by revenue
• Worldwide 2.5G (GPRS/EDGE, CDMA 1xRTT) mobile phone semiconductor rankings by revenue
• Worldwide mobile phone semiconductor rankings by key chipsets (discrete baseband processor, total baseband processor, baseband analog, transceiver, and power amplifier)

IDC' s current vendor share analysis for the worldwide mobile phone semiconductor market in 2009 shows the industry' s first year-over-year decline in revenue growth since 2001. Revenue dropped 6.3% from 2008 levels in direct response to the global economic slowdown over the past couple years. For select mobile phone chipsets, including discrete and integrated baseband processors and applications processors, multimedia coprocessors, analog baseband, transceivers, power amplifiers, and connectivity chipsets, the market declined from $23.6 billion in 2008 to $22.1 billion in 2009. This market decline was felt in virtually all geographic regions and across all core mobile phone chipsets.

The top vendor rankings for 2009 however remained fairly steady, with the top 5 chipset suppliers retaining their 2008 ranking. Qualcomm remained number 1 in key chipset revenue, with 25% vendor share, followed by Texas Instruments, with 12% share. The third position was earned by ST-Ericsson, due to the combined revenues of ST Micro and Ericsson, which completed their joint venture in February 2009. The fourth-largest vendor was again Mediatek, despite it achieving a robust growth of 30% in a difficult year. The fifth spot was again Infineon, which was able to maintain 5% growth during the year. Broadcom, RFMicro, Skyworks, Renesas, and Marvell rounded out the top 10 chipset suppliers for 2009. Freescale dropped in ranking from number 6 last year to number 11 in 2009 as it continued to diversify away from mobile phones toward other consumer products.

For the leading-edge 3.5G air generation, which includes HSDPA, HSUPA, HSPA, and HSPA+, Qualcomm was the leading supplier, with 34% of the market, followed by ST-Ericsson at 15%, Texas Instruments at 12%, and Infineon at 7%.

For the 3G air generation, Qualcomm again was the leader, with 39% vendor share, followed by Texas Instruments at 12% and ST-Ericsson at 6.5%.

For the 2.5G air generation, Mediatek was the leader, with 19% with its strong position in GPRS/EDGE, followed by Qualcomm, with its control of CDMA2000 1xRTT, at number 2 with 14% share.

For key chipset components, Qualcomm continued to control and lead in the baseband processor, both digital and analog, in addition to the transceiver with its platform solutions. Texas Instruments, Mediatek, and ST-Ericsson followed in the rankings for digital basebands, while ST-Ericsson, Infineon, and Texas Instruments followed in the rankings for analog basebands. Mediatek, Infineon, and ST-Ericsson were number 2, 3, and 4, respectively, for transceiver chipsets. For power amplifiers, the vendor mix is typically different due to the non-CMOS nature of the technology. This component class was lead by RF Micro, and followed by Skyworks, Triquint, and Renesas.

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