Vodafone W-CDMA Access Gateway Femtocell - Model 253104761

Abstract

This report covers the design analysis of a Vodafone W-CDMA BSR femtocell unit. This unit is the first W-CDMA femtocell released to the UK market. The unit was manufactured in 2008 and released to the market in 2009.

The following semiconductor & passive component suppliers are included in this report: Analog Device, Epcos AG, Hynix Semiconductor, IDT, Intersil, Lattice Semiconductor, Marvell Semiconductor, Maxim Integrated Products, Micron Technology, Murata Manufacturing, ON Semiconductor, SAGEM Communications, Skyworks Solutions, Texas Instruments, Xilinx Semiconductor

• Features
• Complete Part Number/Marking
• Component Manufacturer Identification
• Function Component Description
• Package Type

Important Note: There is NO component pricing contained within the report.

Table of Contents

EXECUTIVE SUMMARY

• Active/Passive Component Summary
• Important Note:

CHAPTER 1: W-CDMA/HSPA FEMTOCELL

• 1.1 Overview of Femtocell Overlay

CHAPTER 2: VODAFONE ACCESS GATEWAY

• 2.1 Product Analysis
• 2.2 Mechanical Analysis
• 2.3 System Architecture Analysis

CHAPTER 3: FEMTOCELL

APPENDIX A - PASSIVE CASE SIZE ANALYSIS

APPENDIX B - ACTIVE COMPONENT MARKET SHARE ANALYSIS

TABLES

• Table 1: Area A Bill of Materials
• Table 2: Area B Bill of Materials
• Table 3: Area C Bill of Materials
• Table 4: Area D Bill of Materials
• Table 5: Area E Bill of Materials
• Table 6: Area F Bill of Materials
• Table 7: SAGEM Communications GSM/GPRS Module Bill of Materials
• Table 8: Active/Passive Component Distribution by System Subsection
• Table 9: Passive Component Case Size Distribution by System Subsection (con' t)
• Table 10: Active Semiconductor Vendor Distribution by System Subsection

EXHIBITS

• Exhibit 1: Femtocell Overlay Deployment with Macrocell Underlay Network Diagram
• Exhibit 2: Vodafone Access Gateway Product
• Exhibit 3: BSR Femto Front Cover, External and Internal Views
• Exhibit 4: BSR Femto Rear Cover, External and Internal Views
• Exhibit 5: BSR Femto Internal Case, Front and Rear Views
• Exhibit 6: BSR Femto, Front and Rear Views
• Exhibit 7: BSR Femto PCB, Top View
• Exhibit 8: BSR Femto PCB, Bottom View
• Exhibit 9: BSR Femtocell PCB, Top View
• Exhibit 10: BSR Femtocell PCB, Bottom View
• Exhibit 11: Area A Component Diagram
• Exhibit 12: Area B Component Diagram
• Exhibit 13: Area C Component Diagram
• Exhibit 14: W-CDMA TRx Block Diagram
• Exhibit 15: Area D Component Diagram
• Exhibit 16: Area E Component Diagram
• Exhibit 17: Area F Component Diagram
• Exhibit 18: SAGEM Communications GSM/GPRS Module w/ Shield
• Exhibit 19: SAGEM Communications GSM/GPRS Module Component Diagram
• Exhibit 20: SAGEM Communications GSM/GPRS Module PCB, Bottom View
• Exhibit 21: Passive Component Case Size Distribution
• Exhibit 23: Active Semiconductor Component Share
• Exhibit 24: Active Semiconductor Market Share by Vendor
• Exhibit 25: IC (>8 pin) vs. Discrete Active Semiconductor Share
• Exhibit 26: High Pin Count (64+) Active Semiconductor Market Share by Vendor